
This research programme is aimed at developing quantum information devices based on our original EIT in solids and our proposed frequency-domain quantum computer with quantum optical methods using lasers and optical cavities.
Candidates should possess expertise in solid state physics, material science, and thin film physics.
This programme develops spin-torque nano-oscillators composed of magnetic multilayers. Microwave- frequency oscillations of magnetization are induced by the spin momentum transfer under the dc electric current. Experiments concerning the oscillation phenomena and analyses by theories and micromagnetic simulations are under development. The study is related to the sessions of intensive studies at INTERMAG and MMM conferences.
Candidates should have in-depth knowledge of magnetic materials, the magneto-resistance effect, and the spin-torque effect.
The goal of this programme is to realize novel nano-devices using combinations of the top-down and bottom-up nano-fabrication techniques that Toshiba possesses, including 10 nm-scale fabrication using self-assembled materials and photo- and/or electron-beam lithography, in order to investigate nano-scale effects.
Candidates should be capable of designing nano-materials or nano-devices, and concepts for novel nano-devices are welcome. Knowledge of material physics, electronic physics or physical chemistry is required as well as an interest in nano-technology.
The potential for obtaining desired light-emission characteristics by design has drawn attention to organic light-emitting materials. This research programme focuses on the characterization of new organic functional materials and innovative light-emitting devices. In particular, novel lighting sources and displays based on polymers are being developed. The field of research is expected to cover that represented by conferences such as SID, SPIE, and MRS.
Candidates should possess expert knowledge of organic light-emitting materials.
The semiconductor power module is a key component in battery-powered vehicles and photovoltaic power generation. Research is being carried out to improve heat resistance and heat dissipation performance of the power module and the thermal fatigue reliability of the packaging. A method for reducing the time required by the thermal cycling tests is also being sought. This project is concerned with the field of research covered by IEEE Transactions on Components and Packaging Technologies.
Candidates should have in-depth knowledge of heat conduction or material stress.